Circuit-and-heat-dissipation assembly and method of making the same
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United States of America Patent
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Jul 18, 2017
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app pub date -
Jun 19, 2015
filing date -
Jun 23, 2014
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Abstract
A circuit-and-heat-dissipation assembly includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer.
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