Metal/ceramic bonding substrate and method for producing same
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United States of America Patent
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Jul 18, 2017
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N/A
app pub date -
Mar 29, 2011
filing date -
Mar 23, 2011
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Abstract
A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.
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