Chip on film flexible circuit board and display device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9713249
APP PUB NO 20150173170A1
SERIAL NO

14235955

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Abstract

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A Chip on Film (COF) flexible circuit board and a display device using the COF flexible circuit board are provided. The circuit board includes: a substrate; a plurality of conductive terminals arranged separately in parallel over the substrate, each of the plurality of conductive terminals including a wide line and a narrow line; and a anisotropic conductive adhesive region provided over the substrate. A connection site of the wide line and the narrow line is located in an overlapping area of the anisotropic conductive adhesive region and the substrate. The embodiments of the invention can reduce the probability of the circuit board being broken and the undesirable phenomena such as open circuit.

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Patent Owner(s)

Patent OwnerAddress
HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO LTD230012 HEFEI NEW DISTRICT TONGLING NORTH ROAD NO 2177 NO HE FEISHI AN HUISHENG 230012
BOE TECHNOLOGY GROPU CO LTDNO 10 JIUXIANQIAO RD CHAOYANG DISTRICT BEIJING 100015

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Liang Beijing, CN 89 333
Gong, Xiaowei Beijing, CN 20 60
Huang, Yang Beijing, CN 72 97
Li, Yang Beijing, CN 1182 7549
Nie, Chunyang Beijing, CN 30 43
Qi, Peng Beijing, CN 28 18
Sun, Lian Beijing, CN 2 2
Wang, Min Beijing, CN 957 5670

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