Apparatus, system and method for use in mounting electronic elements
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United States of America Patent
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Jul 18, 2017
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N/A
app pub date -
Feb 12, 2008
filing date -
Feb 12, 2007
priority date (Note) -
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Abstract
The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one side surface. A recess is formed in the first surface and extends into the casing. plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation.
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