Bonding apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 18, 2017
Issued Date -
N/A
app pub date -
Oct 28, 2014
filing date -
Nov 7, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A bonding apparatus bonds a plurality of device chips on a plurality of electrode pads that are provided to a surface of a substrate. The bonding apparatus includes a stage, a head unit, a head lifting mechanism, a head vibrator, a heater, and a bonding region observation component. The substrate is placed and supported on the stage. The head unit holds the device chips. The head lifting mechanism raises and lowers the head unit in an up and down direction relative to the stage. The head vibrator vibrate the head unit in the up and down direction. The heater heats a bonding paste that bonds the device chips and the electrode pads. The bonding region observation component observes a region that includes at least a peripheral part of the electrode pads.
First Claim
Other Claims data not available
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International Classification(s)
Cited Art Landscape
Patent Citation Ranking
- 4 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jan 18, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 18, 2029 |
