Method and system for heterogeneous substrate bonding for photonic integration
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United States of America Patent
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Jul 18, 2017
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Oct 12, 2015
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Oct 13, 2009
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Abstract
A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector.
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