Device for assembling a chip on a substrate by providing a solder-forming mass
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United States of America Patent
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Jul 11, 2017
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N/A
app pub date -
Jun 25, 2014
filing date -
Oct 10, 2008
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Abstract
A device for assembling an element on a surface of a substrate by providing a solder-forming mass. The device has a means for moving the element and a measurement means. The means for moving the element includes a support and an element gripper member. The gripper member has a vertical axis that is perpendicular to the surface of the substrate and is mounted to move freely in translation on the support in a direction parallel to its vertical axis. The measurement means measures a variation of the position of the element in vertical translation.
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