Waterfall wire bonding

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United States of America Patent

PATENT NO 9704797
APP PUB NO 20140183727A1
SERIAL NO

14118485

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Abstract

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A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.

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Patent Owner(s)

  • SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Chin Tien Taichung, CN 17 69
Lu, Zhong Shanghai, CN 29 172
Xiao, Fuqiang Shanghai, CN 4 17
Yu, Cheeman Fremont, US 31 167
Yu, Fen Shanghai, CN 10 13

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