Bonding of substrates induced by ionizing radiation
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United States of America Patent
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Jul 11, 2017
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Dec 4, 2015
filing date -
Dec 11, 2012
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Abstract
A reactive polymer composition is provided, containing a (co)polymer that forms one or more reactive moities, either directly or indirectly, upon application of an ionizing radiation; and a multifunctional curing coagent, along with systems and methods for bonding substrates to one another using such a composition.
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