Heater sensor complex with high thermal capacity
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United States of America Patent
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Jul 11, 2017
Grant Date -
Feb 2, 2017
app pub date -
Dec 18, 2014
filing date -
May 28, 2014
priority date (Note) -
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Abstract
The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.
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