Formulated resin compositions for flood coating electronic circuit assemblies
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United States of America Patent
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Jul 4, 2017
Grant Date -
Dec 4, 2014
app pub date -
May 31, 2014
filing date -
May 31, 2013
priority date (Note) -
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Abstract
Formulated resin systems containing polymeric flood coat compositions are provided herein and characterized by having an initial mix thixotropic index from 1 to 5, and a gel time from 5 to 15 minutes such that when cured the compositions provide a Shore hardness from 15 A to 90 A, a thickness on horizontal surfaces from 20 mils to 75 mils, and a thickness on vertical surfaces from 4 mils to 20 mils. Electronic circuit assemblies flood coated with such formulated resin systems, and methods for protecting and supporting said assemblies, are also provided.
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