High current interconnect system and method for use in a battery module
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United States of America Patent
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Jul 4, 2017
Issued Date -
N/A
app pub date -
Mar 31, 2014
filing date -
Sep 6, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board (PCB) assembly includes a PCB and a high current interconnect mounted on the PCB. The high current interconnect is configured to electrically couple a first high current bladed component, a second high current bladed component, and a trace disposed on the PCB. The high current interconnect includes feet made of a conductive material that are coupled to the PCB. The trace is coupled to the feet via a weld.
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International Classification(s)
- H02J:CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR D....
- H01M:PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT....
- H01R:ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL AS....
- B60R:VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT ....
- G01R:MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC V....
- H01H:ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PR....
- B60L:ELECTRIC EQUIPMENT OR PROPULSION OF ELECTRICALLY-P....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- H02H:EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
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