Apparatus having a spring plate connecting with 3D circuit terminals
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 4, 2017
Issued Date -
N/A
app pub date -
Dec 9, 2014
filing date -
Dec 11, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus having a spring plate connecting with 3D circuit terminals comprises a base having a top surface and a thickness surface. At least one bulged plane is formed on a predetermined location of the top surface. A side surface of the bulged plane is declined from inside to outside. At least one extending end is formed on the thickness surface of the base, by corresponding to and extending toward a direction opposite to the bulged plane. A declined surface is formed on an outer side of the extending end, by extending and declining from top to bottom and also from inside to outside. At least one metal layer is formed on the bulged plane and the declined surface by means of 3D electroplating in order to form a circuit connecting the terminals and the spring plate.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully