Multi-pressure MEMS package
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United States of America Patent
Stats
-
Jul 4, 2017
Issued Date -
N/A
app pub date -
May 2, 2016
filing date -
Mar 24, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The present disclosure relates to a microelectromechanical systems (MEMS) package having two MEMS devices with different pressures, and an associated method of formation. In some embodiments, the (MEMS) package includes a device substrate and a cap substrate bonded together. The device substrate includes a first trench and a second trench. A first MEMS device is disposed over the first trench and a second MEMS device is disposed over the second trench. A first stopper is raised from a first trench bottom surface of the first trench but below a top surface of the device substrate and a second stopper is raised from a second trench bottom surface of the second trench but below the top surface of the device substrate. A first depth of the first trench is greater than a second depth of the second trench.
First Claim
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Cited Art Landscape
Patent Citation Ranking
- 9 Citation Count
- H01L Class
- 18.50 % this patent is cited more than
- 8 Age
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