System and method for embossing the wire side of a molded fiber article
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 4, 2017
Grant Date -
May 21, 2015
app pub date -
Nov 18, 2014
filing date -
Nov 18, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A system and method for constructing a molded fiber article capable of having detailed indicia embossed thereon is provided. A molded fiber article having a smooth surface with detailed indicia is also provided. The system includes using a wire mesh structure coupled with an embossing plate such that the embossing plate imparts a smooth surface with indicia onto the molded fiber article during formation. The smooth surface if the embossing plate allows for greater detail than that of the textured surface created by the wire mesh structure. The system may also include a forming die that generally conforms to the wire mesh structure to facilitate formation of the molded fiber article. The wire mesh structure may include a recessed area for housing the embossing plate, which may be attached to the wire mesh structure using fasteners and a backing plate.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2014 Application Filing Year
- B29C Class
- 4829 Applications Filed
- 3911 Patents Issued To-Date
- 80.99 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B29C Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Jan 4, 2025 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 4, 2029 |
