Apparatus and method for forming electrical solder connections in a disk drive unit
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jul 4, 2017
Issued Date -
N/A
app pub date -
May 14, 2012
filing date -
Mar 28, 2012
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An apparatus for forming electrical solder connections in a disk drive unit includes: a nozzle device for carrying out soldering on two pre-welding surfaces; a solder ball feeding device for transferring a single solder ball to the nozzle device; a gas pump device for supplying pressurized gases to the nozzle device; a laser device for emitting laser beams to the solder ball; and a control device including at least one sensor for at least detecting status of the solder ball or pressure in the nozzle device or distance between the nozzle device and the pre-welding surfaces, and a control unit connected with the at least one sensor. The present invention can easily control the solder ball, the pressurized gases and the laser beams, thereby keeping the pressure of the nozzle device and the laser energy stable and, in turn improving the soldering result.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully