Manufacturing method of LED carrier
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United States of America Patent
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Jun 27, 2017
Grant Date -
Jul 21, 2016
app pub date -
Mar 29, 2016
filing date -
Apr 23, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
An LED carrier includes a substrate, a metallic layer, an insulating layer, and a reflecting layer. The metallic layer is disposed on the substrate and has a die bonding region and a ring-shaped wiring region separated from the die bonding region. A region arranged between the die bonding region and the ring-shaped wiring region is defined as an insulating region. The insulating layer at least partially covers the insulating region. The reflecting layer is arranged above the die bonding region and at least partially covers the top surface of the insulating layer. Moreover, the instant disclosure also provides a manufacturing method of an LED carrier.
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