Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 20, 2017
Issued Date -
N/A
app pub date -
Mar 20, 2014
filing date -
Mar 21, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A soldering device comprising: a first treatment part that sets a component having an electrode; a second treatment part separated by an opening-closing unit, the second treatment part sending the component on to a third treatment part; the third treatment part separated by an opening-closing unit, the third treatment part causing the component to contact an organic fatty-acid-containing solution and move horizontally; a fourth treatment part having a unit for moving the component to a space portion and causing molten solder to adhere to the electrode; and a unit for removing excess molten solder; a fifth treatment part for horizontally moving the component moved downward by the fourth treatment part; a sixth treatment part separated by an opening-closing unit, the sixth treatment part sending the component on to a seventh treatment part; and the seventh treatment part separated by an opening-closing unit, the seventh treatment part taking out the component.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully