Miniature surface mount device with large pin pads

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United States of America Patent

PATENT NO 9685592
SERIAL NO

13153888

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Abstract

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One embodiment of the surface mount LED package includes a lead frame and a plastic casing at least partially encasing the lead frame. The lead frame includes a plurality of electrically conductive chip carriers. There is an LED disposed on each one of the plurality of electrically conductive chip carriers. A profile height of the surface mount LED package is less than about 1.0 mm.

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Patent Owner(s)

Patent OwnerAddress
CREELED INC4400 SILICON DRIVE DURHAM NC 27703

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Chi Keung Sheung Shui, HK 12 117
Emerson, David Todd Chapel Hill, US 82 2783
Lau, Yue Kwong Laguna, HK 6 55
Li, Fei Hong Huizhou, CN 5 54
Pang, Chak Hau Fanling, HK 12 232
Zhang, Jun Huizhou, CN 1152 7034

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