Contact probe and semiconductor element socket provided with same
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United States of America Patent
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Jun 20, 2017
Issued Date -
N/A
app pub date -
May 23, 2013
filing date -
Jul 23, 2012
priority date (Note) -
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Abstract
The invention provides a contact probe and a semiconductor element socket provided with the same, the contact probe capable of smooth inspection of a device while securing good conductivity. A contact probe has an upper plunger having a contact stem portion, a lower plunger having an insertion hole with which the contact stem portion is capable of coming into contact, and a coil spring connected to the upper plunger and the lower plunger in such a way as to cover the contact stem portion. The coil spring is configured by helically winding a wiring, and includes a guide portion wound tight in the axial direction of the coil spring by the wire, the guide portion located on the lower plunger side of the coil spring and also includes the upper plunger side portion than an upper end portion of the insertion hole.
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