Light emitting device substrate and method for manufacturing the same
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United States of America Patent
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Jun 20, 2017
Grant Date -
Apr 16, 2015
app pub date -
Oct 14, 2014
filing date -
Oct 15, 2013
priority date (Note) -
In Force
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Abstract
The present invention relates to an optical device substrate comprising: unit block substrates wherein a flat panel metal substrate are partitioned into n (n>1) number of optical device attachment areas, and the insulating members are formed inside the metal substrate in a way that the adjacent partitioned areas are insulated; first horizontal insulating members for insulating between the unit block substrates being stacked; outer metal electrode substrates bonded to the unit block substrates located in the upper end and the lower end among the unit block substrates being stacked; second horizontal insulating members for insulating between the outer metal electrode substrates and the unit block substrates; a pair of inner metal electrode substrates inserted instead of the first horizontal insulating members into more than any one of the adjacent unit block substrates; and third horizontal insulating members for insulating the pair of inner metal electrode substrates.

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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
POINT ENGINEERING CO LTD | 89 ASANVALLEY-RO DUNPO-MYEON ASAN-SI CHUNGCHEONGNAM-DO 31409 |
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Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Ahn, Bum Mo | Yongin-si, KR | 162 | 241 |
Park, Seung Ho | Hwaseong-si, KR | 185 | 355 |
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