Partial plating device and partial plating method

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United States of America Patent

PATENT NO 9683307
SERIAL NO

14351713

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.

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Patent Owner(s)

Patent OwnerAddress
DOWA METALTECH CO LTDCHIYODA-KU TOKYO 101-0021

International Classification(s)

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  • 2012 Application Filing Year
  • C25D Class
  • 441 Applications Filed
  • 326 Patents Issued To-Date
  • 73.93 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201220132014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Arai, Kentaro Saitama, JP 44 499
Miyazawa, Hiroshi Saitama, JP 107 941

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Patent Citation Ranking

  • 0 Citation Count
  • C25D Class
  • 0 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges213330255411101 - 1011 - 2021 - 3031 - 4051 - 6061 - 70100 +020406080100120140160180200220240260280300320340360

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