Fixation of heat sink on SFP/XFP cage

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United States of America Patent

PATENT NO 9681583
SERIAL NO

14387451

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Abstract

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An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.

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Patent Owner(s)

Patent OwnerAddress
TELECOM HOLDING PARENT LLC338 PIER AVENUE SUITE 4325 HERMOSA BEACH CA 90254

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ba, Qinzhen Shanghai, CN 2 7
Duan, Zongxian Shanghai, CN 3 9
Lei, Zhen Shanghai, CN 16 23
Yu, Huihui Shanghai, CN 3 7

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