Capacitive grounding methods and apparatus for mobile devices
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United States of America Patent
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Jun 13, 2017
Grant Date -
May 21, 2015
app pub date -
Nov 20, 2013
filing date -
Nov 20, 2013
priority date (Note) -
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Abstract
Grounding apparatus for mobile devices and methods of utilizing and manufacturing the same. In one embodiment, an outer metallized surface of a mobile device is configured to capacitively couple a metal back cover to the device ground. Specifically, in one implementation, an exterior surface of the mobile device is metalized and coupled to the device ground via galvanic contacts. The exterior metalized surface is configured to be capacitively coupled a metal back cover of a mobile device to the device ground when the back cover is installed on the mobile device. By capacitively coupling the back cover to the device ground via the exterior metalized surface, the need to otherwise ground the back cover through the use of galvanic contacts is obviated, thereby reducing the number of components needed.
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