Bonding stage and method of manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9679866
SERIAL NO

14990199

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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Provided is a bonding stage including: a rigid block (10) having a plurality of projections (11) on a surface (16) of the base body, upper surfaces of the projections being flat; a flat plate (20) fixed to supporting surfaces (18) on the projections (11); a ceramic plate (30) suctioned and fixed to the flat plate (20); a plate-shaped heater (40) disposed on a side of the rigid block (10) of the flat plate (20); and coil springs (50) disposed between the heater (40) and the rigid block (10), the coil springs (50) bringing the heater (40) into close contact with a surface of the flat plate (20) on the side of the rigid block (10).

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Patent Owner(s)

Patent OwnerAddress
SHINKAWA LTDJAPAN TOKYO MUSASHIMURAYAMA FLAT TWO CHOME 51 TO 1

International Classification(s)

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  • 2016 Application Filing Year
  • H01L Class
  • 27971 Applications Filed
  • 23507 Patents Issued To-Date
  • 84.05 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20162017201820192020202120222023202420250255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Wada, Shoji Tokyo, JP 26 203

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Patent Citation Ranking

  • 1 Citation Count
  • H01L Class
  • 18.50 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges26979357140748325312788503629173801 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050010001500200025003000350040004500500055006000650070007500800085009000950010000

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