Bonding stage and method of manufacturing the same
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United States of America Patent
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Jun 13, 2017
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N/A
app pub date -
Jan 7, 2016
filing date -
Jul 10, 2013
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Abstract
Provided is a bonding stage including: a rigid block (10) having a plurality of projections (11) on a surface (16) of the base body, upper surfaces of the projections being flat; a flat plate (20) fixed to supporting surfaces (18) on the projections (11); a ceramic plate (30) suctioned and fixed to the flat plate (20); a plate-shaped heater (40) disposed on a side of the rigid block (10) of the flat plate (20); and coil springs (50) disposed between the heater (40) and the rigid block (10), the coil springs (50) bringing the heater (40) into close contact with a surface of the flat plate (20) on the side of the rigid block (10).
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