Enclosure with multiple heat dissipating surfaces
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 13, 2017
Issued Date -
N/A
app pub date -
Apr 6, 2016
filing date -
Apr 10, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A fanless industrial computer enclosure dissipates heat generated by the hottest components on heat sinks dedicated to respective heat zones within the enclosure. Heat generated by the component that operates at the highest temperature in each heat zone is conducted to a heat sink on the exterior of the enclosure. Using a heat sink dedicated to each heat zone, heat generated by components such as an industrial computer, storage devices, power supply, or other electrical components, is dissipated on the outer surface of the enclosure to the surrounding ambient environment. Providing a low resistance heat conductive path from the hottest components to respective heat sinks to dissipate heat outside the enclosure from each heat zone creates an environment within the enclosure where disk drives do not exceed the specified upper operating temperature rating without regard to the operating temperature of other electrical components in the enclosure.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2016 Application Filing Year
- G06F Class
- 60255 Applications Filed
- 46180 Patents Issued To-Date
- 76.65 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 6 Citation Count
- G06F Class
- 14.60 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 13, 2024 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 13, 2028 |
