Methods to manufacture semiconductor probe tips
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United States of America Patent
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Jun 13, 2017
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app pub date -
Feb 11, 2014
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Feb 6, 2014
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Abstract
The method for forming a semiconductor probe tip comprises depositing a first copper layer onto exposed electrically conductive areas of a wafer. The first copper layer surrounds a non-conductive polymer structure on the wafer. The non-conductive polymer structure is removed to form a primary cavity in the first copper layer. The wafer and the primary cavity are coated with a polymer layer. Regions of the polymer layer are removed to form a secondary cavity within and alongside the primary cavity. A metal layer is deposited on exposed electrically conductive areas of the wafer and within bounds of the secondary cavity.
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