Thermosetting conductive paste
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United States of America Patent
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Jun 13, 2017
Grant Date -
Jun 25, 2015
app pub date -
Dec 18, 2014
filing date -
Dec 25, 2013
priority date (Note) -
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Abstract
Provided is a heat curable conductive paste used to form a conductive coating. The heat curable conductive paste comprises a conductive powder, a heat curable epoxy resin and a curing agent. In the conductive powder, an aliphatic polyvalent carboxylic acid is adhered on a surface of a powdered metal core. The epoxy resin comprises a bifunctional or higher polyfunctional epoxy resin and a monofunctional epoxy resin, and the polyfunctional epoxy resin and the monofunctional epoxy resin have a mass ratio of 90:10 to 20:80.
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