Integrated MEMS device
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United States of America Patent
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Jun 13, 2017
Grant Date -
Aug 25, 2016
app pub date -
May 3, 2016
filing date -
Jan 28, 2013
priority date (Note) -
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Abstract
An integrated MEMS device is provided. The integrated MEMS device comprises a circuit chip and a device chip. The circuit chip has a patterned first bonding layer disposed thereon, the bonding layer being composed of a conductive material/materials. The device chip has a first structural layer and a second structural layer, the first structural layer being connected to the second structural layer and the first bonding layer of the circuit chip, and being sandwiched between the second structural layer and the circuit chip. A plurality of hermetic spaces are enclosed by the first structural layer, the second structural layer, the first bonding layer and the circuit chip.
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