Induction heating apparatus and induction heating method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 6, 2017
Grant Date -
Apr 2, 2015
app pub date -
Dec 9, 2014
filing date -
Aug 9, 2010
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor substrate thermal treatment apparatus enables excellent heating control in suppressing influence of mutual induction between induction heating coils even when the induction heating coils are arranged in the vertical direction while providing horizontal magnetic flux to susceptors. The apparatus indirectly heats wafers mounted on horizontally-arranged susceptors including induction heating coils to form alternate-current magnetic flux in a direction parallel to a mount face of the susceptor. The wafer are arranged at an outer circumferential side of the susceptor. The induction heating coils are structured with at least one main heating coil and subordinate heating coils electromagnetically coupled with the main heating coil. Inverse coupling coils inversely-coupled to the subordinate heating coils are provided to the main heating coil, and zone control means separately controls a power ratio while synchronizing frequencies and current waveforms of current to the main heating coil and adjacent subordinate heating coils.
First Claim
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International Classification(s)
- 2014 Application Filing Year
- H01L Class
- 23828 Applications Filed
- 21803 Patents Issued To-Date
- 91.51 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 8 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 6, 2024 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 6, 2028 |
