Three-dimensional mounting method and three-dimensional mounting device

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United States of America Patent

PATENT NO 9673166
SERIAL NO

15038963

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Abstract

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A three-dimensional mounting method for successively laminating N number of upper-layer joining materials includes positioning a first upper-layer joining material relative to a lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position of the first upper-layer joining material by a two-field image recognition unit, storing positional coordinates of the alignment position of the lowermost-layer joining material, positioning an (n+1)-th upper-layer joining material relative to an n-th upper-layer joining material by recognizing an upper face alignment position of the n-th upper-layer joining material and a lower face alignment position of the (n+1)-th upper-layer joining material, storing positional coordinates of the upper face alignment position of the n-th upper-layer joining material, recognizing an upper face alignment position of the N-th uppermost-layer joining material, and storing positional coordinates of the upper face alignment position of the N-th uppermost-layer joining material.

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Patent Owner(s)

Patent OwnerAddress
TORAY ENGINEERING CO LTDOSAKA JAPAN OSAKA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawakami, Mikio Otsu, JP 6 40
Nishimura, Koji Otsu, JP 77 399
Terada, Katsumi Otsu, JP 37 330

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