High-frequency package
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United States of America Patent
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Jun 6, 2017
Grant Date -
Feb 16, 2017
app pub date -
Oct 15, 2015
filing date -
Aug 13, 2015
priority date (Note) -
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Abstract
A high-frequency package comprises a ground lead occupying a side of the high-frequency package; and a signal lead comprising at least a protrusion protruding from a central portion of the signal lead; wherein the ground lead and the signal lead perform as a transmission line, and the at least a protrusion forms capacitance of the transmission line.
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