Methods of depositing aluminium layers
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United States of America Patent
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Jun 6, 2017
Grant Date -
Aug 16, 2012
app pub date -
Feb 16, 2012
filing date -
Feb 16, 2011
priority date (Note) -
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Abstract
A method of depositing an aluminum film on a substrate includes placing the substrate on a support, depositing a first layer of aluminum onto the substrate with the substrate in an unclamped condition, clamping the substrate to the support and depositing a second layer of aluminum continuous with the first layer. The second layer is thicker than the first layer and the second layer is deposited at a substrate temperature of less than about 22° C.
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