Adhesive compositions and use thereof
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United States of America Patent
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Jun 6, 2017
Grant Date -
Jan 15, 2015
app pub date -
Jan 25, 2013
filing date -
Jan 26, 2012
priority date (Note) -
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Abstract
The present invention relates to new formulations for adhesive compositions and also to adhesive compositions particularly for a hybrid adhesive comprising at least one mixture of an amino resin and at least one polyether, and the combination of this mixture with isocyanate, and also to the use of polyethers in adhesives based on amino resins. These adhesive compositions are especially suitable for use as adhesives for woodbase materials, more particularly OSB boards, fiberboards, or chipboards. In a further aspect the present invention relates to processes for producing such woodbase materials from lignocellulosic products of comminution, more particularly to processes for producing OSB boards, wood fiberboards, or chipboards, where the lignocellulosic products of comminution are contacted with the adhesive composition of the invention and subsequently the woodbase materials are obtained by pressing with heat treatment. Lastly, the present invention is directed to woodbase materials obtainable accordingly.
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