Underfill composition for encapsulating a bond line

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United States of America Patent

PATENT NO 9670377
SERIAL NO

14196581

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Abstract

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An underfill composition for encapsulating a bond line and a method of using the underfill composition are described. Advantageously, the disclosed underfill composition in an uncured state has a fluidity value of less than about ten minutes over about a two centimeter distance at a temperature of about 90 degrees C. and at a bond line thickness of about 50 microns or less and still have a bulk thermal conductivity that is greater than about 0.8 W/mK in the cured state.

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Patent Owner(s)

Patent OwnerAddress
NAMICS CORPORATIONNIIGATA-SHI NIIGATA 950-3131

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Czubarow, Pawel Wellesley, US 37 344
Masuko, Tsutomu Niigata, JP 5 146
Sato, Toshiyuki Niigata, JP 193 2639

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