Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom

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United States of America Patent

PATENT NO 9670362
SERIAL NO

14367337

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Abstract

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The present invention relates to a thermoset resin composition, and a prepreg and a laminate for a printed circuit board manufactured therefrom. The thermoset resin composition comprises the following components: a phosphorus-containing polyphenyl ether resin having low molecular weight, an epoxy resin, a cyanate resin and an accelerator. The prepreg manufactured using the resin composition comprises a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The laminate for a printed circuit board manufactured using the resin composition comprises a plurality of laminated prepregs, a metal foil covering one or two faces of the laminated prepregs by pressing, with each prepreg comprising a base material and the thermoset resin composition adhered to the base material by impregnation and drying. The thermoset resin composition of the present invention has properties such as a low dielectric constant and a dielectric dissipation factor, high heat resistance, a high glass transition temperature, and flame retardancy, etc. The laminates for a printed circuit board manufactured using same have excellent metal foil peel strength, heat resistance and dielectric properties, and are suitable for high frequency and high speed electronic circuit boards.

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Patent Owner(s)

Patent OwnerAddress
SHENGYI TECHNOLOGY CO LTDNO 5 GONGYE WEST ROAD SONGSHAN LAKE PARK DONGGUAN CITY GUANGDONG PROVINCE 523808 DONGGUAN CITY GUANGDONG PROVINCE 523808

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fang, Kehong Guangdong, CN 13 17
Meng, Yundong Guangdong, CN 5 3

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