Polishing pad and method for making the same

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United States of America Patent

PATENT NO 9669518
APP PUB NO 20150099439A1
SERIAL NO

14468621

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Abstract

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The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.

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Patent Owner(s)

Patent OwnerAddress
SAN FANG CHEMICAL INDUSTRY CO LTDKAOHSIUNG CITY

International Classification(s)

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  • 2014 Application Filing Year
  • B24B Class
  • 633 Applications Filed
  • 543 Patents Issued To-Date
  • 85.79 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20142015201620172018201920202021202220230255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Feng, Chung-Chih Kaohsiung, TW 112 308
Hung, Yung-Chang Kaohsiung, TW 45 119
Wu, Wen-Chieh Kaohsiung, TW 53 137
Yao, I-Peng Kaohsiung, TW 79 189

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Patent Citation Ranking

  • 0 Citation Count
  • B24B Class
  • 0 % this patent is cited more than
  • 8 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges20960443132201 - 1011 - 2021 - 3031 - 4041 - 50050100150200250300350400450500550600650

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