Polishing pad and method for making the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
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Jun 6, 2017
Grant Date -
Apr 9, 2015
app pub date -
Aug 26, 2014
filing date -
Oct 3, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.
First Claim
all claims..Other Claims data not available
Family

- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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SAN FANG CHEMICAL INDUSTRY CO LTD | KAOHSIUNG CITY |
International Classification(s)

- 2014 Application Filing Year
- B24B Class
- 633 Applications Filed
- 543 Patents Issued To-Date
- 85.79 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Feng, Chung-Chih | Kaohsiung, TW | 112 | 308 |
# of filed Patents : 112 Total Citations : 308 | |||
Hung, Yung-Chang | Kaohsiung, TW | 45 | 119 |
# of filed Patents : 45 Total Citations : 119 | |||
Wu, Wen-Chieh | Kaohsiung, TW | 53 | 137 |
# of filed Patents : 53 Total Citations : 137 | |||
Yao, I-Peng | Kaohsiung, TW | 79 | 189 |
# of filed Patents : 79 Total Citations : 189 |
Cited Art Landscape
- No Cited Art to Display

Patent Citation Ranking
- 0 Citation Count
- B24B Class
- 0 % this patent is cited more than
- 8 Age
Forward Cite Landscape
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Dec 6, 2024 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Dec 6, 2028 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text

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May 02, 2016 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC;REEL/FRAME:039299/0328 Owner name: K/S HIMPP, DENMARK Effective Date: May 02, 2016 |
Mar 03, 2016 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SCHMIDT KINDRED, JON;SORENSEN, BRYANT;WAHL, JERRY;SIGNING DATES FROM 20001128 TO 20001201;REEL/FRAME:037887/0830 Owner name: STARKEY LABORATORIES, INC., MINNESOTA |
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Feb 28, 2009 | AS | ASSIGNMENT | free format text: BILL OF SALE;ASSIGNOR:AMI SEMICONDUCTOR, INC.;REEL/FRAME:024473/0801 Owner name: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC,ARIZONA Effective Date: Feb 28, 2009 free format text: BILL OF SALE;ASSIGNOR:AMI SEMICONDUCTOR, INC.;REEL/FRAME:024473/0801 Owner name: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, ARIZONA Effective Date: Feb 28, 2009 |
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Oct 12, 2006 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:STARKEY LABORATORIES, INC.;REEL/FRAME:018383/0235 Owner name: AMI SEMICONDUCTOR, INC., IDAHO Effective Date: Oct 12, 2006 |
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Dec 05, 2000 | PD | Priority Date |

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