Polishing apparatus
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United States of America Patent
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Jun 6, 2017
Issued Date -
N/A
app pub date -
Mar 11, 2015
filing date -
Mar 13, 2014
priority date (Note) -
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Abstract
A polishing apparatus having a polishing pad surface property measuring device that is capable of measuring surface properties of a polishing pad in a state where a liquid film exists on the polishing pad is disclosed. The polishing apparatus includes a dam configured to dam a liquid on the polishing pad to form a liquid film having a thickness equal to or greater than a prescribed value in at least part of an area on the polishing pad, a light emitter having a light emission end disposed in the liquid film formed by the dam and configured to emit a laser beam onto the polishing pad, a light receiver disposed in the liquid film formed by the dam and configured to receive light scattered by and bounced off the polishing pad at a plurality of angles due to surface properties of the polishing pad after the laser beam is emitted from the light emitter, and a processor configured to perform Fourier transform on the light received by the light receiver into a predetermined wavelength corresponding to a reflection intensity distribution and to determine a feature quantity of the surface properties of the pad.
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