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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
NESTEC S A	AVENUE NESTLE 55 VEVEY CH-1800

International Classification(s)

• A21D:TREATMENT, e.g. PRESERVATION, OF FLOUR OR DOUGH FO....
• A21B:BAKERS' OVENS; MACHINES OR EQUIPMENT FOR BAKING
• A21C:MACHINES OR EQUIPMENT FOR MAKING OR PROCESSING DOU....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Arrachid, Abdessamad	Lille, FR	2	2
Coe, Stephen	Minksip Yorkshire, GB	3	0
De, Acutis Rodolfo	York Yorkshire, GB	7	10
Leadbeater, Richard	North Yorkshire, GB	1	0
Powell, Hugh	York Yorkshire, GB	2	8

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Dec 6, 2024
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Dec 6, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 06, 2017	US,9668489,B2   US9668489B2	GRANTED PATENT AS SECOND PUBLICATION
September 12, 2013	US,20130236622,A1   US20130236622A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9668489

Method and apparatus for making a low density wafer product

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