Method and apparatus for electrical keying of an integrated circuit package having rotationally symmetric footprint
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United States of America Patent
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May 30, 2017
Grant Date -
Apr 2, 2015
app pub date -
Oct 1, 2013
filing date -
Oct 1, 2013
priority date (Note) -
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Abstract
A method and apparatus for adjusting circuit operation in response to physical orientation of an integrated circuit (IC) coupled to a host site via direct soldering or a socket. The IC can be installed in a correct orientation or rotated and installed in an incorrect orientation. The IC may have a square, substantially symmetric footprint and the incorrect orientation may correspond to 90 or 180 degree rotation of the IC from the correct orientation. The orientations may be discerned by sensing electrical characteristics of the installed IC. For example, the IC may ground a detection line when installed in the correct orientation, while the detection line may be floating when the IC is installed in an incorrect orientation. The IC may be switchably connected to other components such as a power supply only when it is detected as being installed in the correct orientation.
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