Inlay PCB with embedded coin board
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United States of America Patent
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May 30, 2017
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N/A
app pub date -
May 17, 2013
filing date -
May 18, 2012
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Abstract
A PCB and a method of manufacturing a PCB with combined inlay-PCB process and embedded coin technology are disclosed. The method and device disclosed herein is able to manufacture an inlay part of a high frequency laminate into FR4 laminate. The present invention is advantageous in many aspects including having an inlay design on the PCB, which can save the cost of high frequency laminate. Further, the inlay PCB with embedded coin technologies can enhance the thermal reliability of the finished PCB.
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