Semiconductor devices with cavities

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United States of America Patent

PATENT NO 9666703
SERIAL NO

14966783

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Abstract

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A semiconductor device comprises a first semiconductor wafer including a cavity formed in the first semiconductor die. A second semiconductor die is bonded to the first semiconductor die over the cavity. A first transistor includes a portion of the first transistor formed over the cavity.

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Patent Owner(s)

Patent OwnerAddress
RENESAS ELECTRONICS AMERICA INC1001 MURPHY RANCH ROAD MILPITAS CA 95035

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Shea, Patrick M Oviedo, US 22 523

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