Method and structure for wafer-level packaging
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United States of America Patent
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May 30, 2017
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app pub date -
Dec 16, 2015
filing date -
Dec 16, 2014
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Abstract
A method for wafer-level packaging includes providing a substrate having a conductive metal pad formed on the surface of the substrate; forming a metal core on the top of the conductive metal pad with the metal core protruding from the surface of the substrate; then, forming an under bump metal layer on the top surface and the side surface of the metal core; and finally, forming a bump structure on the top of the under bump metal layer.
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