Thermal imaging sensors
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United States of America Patent
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May 30, 2017
Grant Date -
Jan 8, 2015
app pub date -
Jan 30, 2013
filing date -
Jan 30, 2012
priority date (Note) -
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Abstract
A sensor device comprises an array of spaced apart sensor elements disposed in a pattern on a substrate. Each sensor element is connected electrically so that a physical variable measured by each sensor element independently can be recorded and/or displayed by an external instrument. The sensing device may be a temperature sensing device, in which case the sensor elements are temperature sensing elements such as negative temperature coefficient (NTC) thermistors. Alternatively the sensing device may be a strain or pressure sensing device, or an optical imaging device, in which case the sensor elements include piezoresistors or photoresistors. The sensor elements may be connected in a common source or write all-read one configuration, in a common output or write one-read all configuration, or in an array comprising X rows and Y columns, in a write X-read Y configuration.
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