Suspensions for protecting semiconductor materials and methods of producing semiconductor bodies
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United States of America Patent
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May 30, 2017
Grant Date -
Jun 23, 2016
app pub date -
Feb 25, 2016
filing date -
Mar 3, 2011
priority date (Note) -
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Abstract
A suspension for protecting a semiconductor material, comprising a carrier medium, trimethylolpropane as a plasticizer, benzotriazole derivate as an absorber dye, and inorganic particles selected from the group consisting of aluminum nitride, silicon nitride and boron nitride, wherein the thermal conductivity of the suspension is about 1 W/mk to about 2 W/mk.
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