Resin composition for laser direct structuring, resin molded article, and method for manufacturing molded resin article with plated layer

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United States of America Patent

PATENT NO 9663653
APP PUB NO 20150111041A1
SERIAL NO

14241634

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a resin composition capable of achieving a higher plating property. The resin composition comprises, relative to 100 parts by weight of a resin component comprising 30 to 100% by weight of a polycarbonate resin and 70% by weight or less of a styrene-based resin, 10 to 100 parts by weight of a glass filler and 2 to 20 parts by weight of a laser direct structuring additive,

    wherein the laser direct structuring additive comprises a metal oxide particle comprising titanium oxide coated with a composition comprising tin as a main component and antimony.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI ENGINEERING-PLASTICS CORPORATIONTOKYO 105-0021

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maruyama, Hiroyoshi Hiratsuka, JP 33 260
Motegi, Atsushi Hiratsuka, JP 26 21

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