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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TOAGOSEI CO LTD	1-14-1 NISHI-SHIMBASHI MINATO-KU TOKYO 1058419 ?1058419

International Classification(s)

• C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
• C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....

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• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Furuta, Naomasa	Nagoya, JP	12	16

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Nov 30, 2024
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Nov 30, 2028

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
May 30, 2017	US,9663598,B2   US9663598B2	GRANTED PATENT AS SECOND PUBLICATION
July 14, 2016	US,20160200842,A1   US20160200842A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9663598

Organosilicon compound-containing thermosetting composition and cured product thereof

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