Tie-layer adhesives for styrenic multi-layer structures
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United States of America Patent
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May 30, 2017
Grant Date -
Oct 30, 2014
app pub date -
Apr 24, 2014
filing date -
Apr 25, 2013
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Abstract
A multilayer structure and a method for forming a multilayer structure, the multilayer structure includes: (A) a first polyolefin layer; (B) a styrene polymer layer; (C) a second polyolefin layer; and (D) at least one tie-layer comprising a tie-layer composition. The tie-layer composition includes: (1) 25 to 75 wt. %, based upon the total weight of the tie-layer composition, of a first copolymer, wherein the first copolymer comprises ethylene derived units and units derived from a C4-8 α-olefin; (2) 5 to 25 wt. %, based upon the total weight of the tie-layer composition, of a polyethylene resin grafted with an ethylenically unsaturated carboxylic acid or acid derivative; (3) 20 to 50 wt. %, based upon the total weight of the tie-layer composition, of a triblock copolymer composition; and (4) optionally, 0.001 to 20 wt. %, based upon the total weight of the tie-layer composition, of a low density polyethylene.
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