MOLDING PACKAGING MATERIAL AND BATTERY CASE

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United States of America Patent

SERIAL NO

15448654

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Abstract

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Provided is a molding packaging material that can have an increased use life, can suppress a decrease over time in inter-layer lamination strength, and has superior molding properties in extrusion molding, draw forming, and the like. The laminate molding packaging material contains: an outside substrate layer (2) comprising a heat-resistant resin; an inside sealant layer (3) comprising a thermoplastic resin; and a metal foil provided between the two layers as a barrier layer (4). In the heat-resistant resin of the outside substrate layer (2), a biaxially oriented polyethyleneterephthalate film is used that, when the tensile breaking strength in the M direction is MB and the tensile breaking strength in the T direction is TB, the following are satisfied:

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Patent Owner(s)

Patent OwnerAddress
RESONAC PACKAGING CORPORATION60 KIYOSAKICHO HIKONE-SHI SHIGA 529-1156

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KURAMOTO, Tetsunobu Isehara-shi, JP 10 47
MINAMIBORI, Yuji Isehara-shi, JP 14 30

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