System and a method for solder mask inspection
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United States of America Patent
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May 23, 2017
Grant Date -
Jul 11, 2013
app pub date -
Jul 10, 2012
filing date -
Jul 6, 2009
priority date (Note) -
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status (Latency Note)
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Abstract
A system and a method for inspection aided printing, the method may include printing, by a printing unit of a system, a pattern on an area of a substrate, during a printing process; inspecting, by an inspection unit of the system, the area to provide inspection results; searching, by a processor of the system, for a defect, based upon the inspection results; and wherein if a defect is found—determining whether to (a) repair the substrate, (b) perform a corrective measure for improving the printing process, or (c) perform no corrective measure in response to the defect.
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